NUMERICAL ANALYSIS AND SIMULATION OF CONJUGATE HEAT TRANSFER STUDY OF ELECTRONIC CIRCUIT BOARD
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Abstract
Present-day interest in the thermal analysis of electronic circuit boards arises mainly because of the failure of such components as a result of thermal fatigue. A thermal/structural ANSYS model was integrated in this study to enable the predictions of thetemperature and stress distribution of vertically clamped parallel circuit boards that include series of symmetrically mounted heated electronic modules (chips). The board was modelled as a thin plate containing heated flush rectangular areas representingthe heat generating modules. The ANSYS model was required to incorporate the effects of mixed convection on surfaces, heat generation in the modules, and conduction inside the board. Appropriate convection heat transfer coefficients and boundary conditions resulted in a temperature distribution in the board and chips.
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