Structural and Thermal Analysis of Copper Coil Using ANSYS

Authors

  • Shivani Nane, Rutuja Kapase, Pooja Kapare, Komal Gangathade, Digambar T. Kashid, Chetan C. Jadhav Department of Mechanical Engineering, SVERI’s College of Engineering, Pandharpur, Maharashtra, India

Keywords:

ANSYS, SOLIDWORKS, Structural, Thermal, Copper coil.

Abstract

In granular machine during extrusion process temperature of water increases this leads wastage of water. Using copper coil, it is possible to maintain the temperature of water. In this present work, structural and thermal analysis of copper coil using ANSYS has been carried out. Analysis is performed for ensuring the safety, stability, and longevity of structures to find temperature distribution, temperature gradient, and heat flowing in the model, as well as the heat exchanged between the model and its environment. Copper coil is modeled using SOLIDWORKS software. Thermal analysis has been executed to find temperature distribution, temperature gradient, and heat flowing in the model, as well as the heat exchanged between the model and its environment. Further structural analysis is carried out for determination of the effects of loads on physical structures and their components. After structural analysis, it is observed that, maximum principle stress induced in copper coil is 41.994MPa and minimum principle stress is -8.9271MPa. Through the thermal analysis, it is seen that, at inlet temperature of water passing through copper coil is 7oC at that point maximum stress is 7.0737MPa and minimum is 6.9945MPa. At outlet of coil, the temperature of water is 15oc at that point maximum stress is 15.005MPa and minimum stress is 14.937MPa.

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Published

2023-07-15

Issue

Section

Articles

How to Cite

Shivani Nane, Rutuja Kapase, Pooja Kapare, Komal Gangathade, Digambar T. Kashid, Chetan C. Jadhav. (2023). Structural and Thermal Analysis of Copper Coil Using ANSYS. International Journal of Innovations in Engineering Research and Technology, 261-265. https://repo.ijiert.org/index.php/ijiert/article/view/3750